Past Presentations
June23, 2025
Subject: The Impact on EMC, SI, and PI When Using Ultra-Thin Laminates in PCBs.
Presenter: Bob Carter and John Ranieri, Oak-Mitsui Technologies
Title: The Impact on EMC, SI, and PI When Using Ultra-Thin Laminates in PCBs
Presenters: Bob Carter and John Ranieri, Oak-Mitsui Technologies
Abstract: The increase in data rates and processing speeds driven by AI and next generation device complexity, require more precise filtering, improved signals, and power with less noise. This discussion will focus on the newest studies showing how using some ultra-thin and high Dk laminates in PCB’s will improve the EMC, SI and PI. It also shows benefits to space utilization, and stack-up thicknesses.
Download Bob’s Presentation.pdf
Bob is Vice President of Marketing, Business Development, and Technology for Oak-Mitsui’s FaradFlex ultra-thin embedded capacitance materials and support of advanced technology VSP and Micro-Thin copper. He has over 35 years of professional experience in printed circuits, advanced electronic materials, MEM’s, RF modules, sensors, and chip packaging at companies such as Xerox, M-Flex, Rogers Corporation, and Panasonic Electronic Materials. He studied Chemical & Materials Engineering and Business Management at California Polytechnic University, Pomona, California and Grand Canyon University, Phoenix, Arizona.
John Ranieri is the OEM Marketing Director for Oak-Mitsui Technology’s FaradFlex™ laminates - thin dielectrics for printed circuit board embedded capacitance. John has over 20 years’ experience in PCB materials at Oak-Mitsui and Rogers Corporation and has worked with OEM customers designing a wide range of high frequency and high-speed PCBs. John’s holds a B.S. in Chemical Engineering from Case Western Reserve University and an MBA from ASU’s W.P. Carey School of Business.
May 5th, 2025
Meeting / Technical Presentation with great speakers from ANSC C63®
The meeting was held at TUV Rheinland Technology & Innovation Center in Boxborough, MA.
Presenter: Art Wall, former FCC Representative to ANSC C63.4, Columbia, MD
Subject: History of ANSI C63.4
Abstract: Art Wall was one of the primary authors of the Federal Communications Commission (FCC) document MP-4 “FCC Procedure for Measuring RF Emissions from Computing Devices” – the document which heavily influenced the first edition of ANSI C63.4. This presentation will discuss the history of the measurement techniques specified in C63.4 and provide some context behind the procedures called out in the standard.
Biography: Art Wall retired from the Federal Communications Commission in 2005 as Deputy Chief of the FCC Laboratory with over thirty-five years of experience in radio regulatory issues, Electro-Magnetic Compatibility (EMC), standards, and conformity assessment. Art was also a consultant for the government and industry for an additional 14 years in the same field. He authored and participated in the development of numerous mandatory and voluntary standards for intentional and unintentional radiators for controlling radio interference. He was active in ANSI C63 for over 40 years and was international Secretary and Chairman of Subcommittee A (dealing measurements and instrumentation) of the International Special Committee for Radio Interference (CISPR) for over 20 years. He also participated in developing and implementing the US-EU MRA and the APEC MRA for telecommunication equipment. Mr. Wall is a Life Fellow of the Institute of Electrical and Electronic Engineers (IEEE) and Life member of the IEEE EMC Society. He has a BSEE from the University of Maryland and an MSEE from George Washington University. He may be reached at artwall43@gmail.com.
Presenter: Zhong Chen, ETS-Lindgren, Cedar Park, TX
Subject: Addressing Under-Testing in EMC Emissions Measurements: A Comparative Analysis of Boresighting and Linear Scanning Methods
Abstract: This presentation examines the critical differences between antenna boresighting and linear scanning techniques during height scans in emissions measurements for frequencies above 1 GHz. At higher frequencies, emissions from typical equipment under test (EUT) exhibit complex radiation patterns. Capturing the true peak radiation becomes a statistical challenge. This presentation explores both experimental and simulation studies conducted by researchers to analyze these phenomena. Additionally, simulations are performed to illustrate and corroborate the findings. By addressing the technical limitations of linear scanning and emphasizing the advantages of boresighting, this discussion seeks to contribute to standards development and enhance the accuracy and reliability of EMC emissions measurements.
Biography: Zhong Chen is Chief Engineer at ETS-Lindgren, located in Cedar Park, Texas. He has over 25 years of experience in RF testing, anechoic chamber design, as well as EMC antenna and field probe design and measurements. He is an active member of the ANSC C63® committee currently serving as Vice-Chair and is the immediate past Chair of Subcommittee 1 which is responsible for the antenna calibration (ANSI C63.5) and chamber/test site validation standards (ANSI C63.4 and the ANSI C63.25 series). Mr. Chen is chair of the IEEE Standard 1309 committee responsible for developing calibration standards for field probes, and IEEE Standard 1128 for absorber evaluation. Currently he is a member of the IEEE EMC Society Board of Directors and a former member of the Antenna Measurement Techniques Association (AMTA) Board of Directors. He is a past Distinguished Lecturer for the EMC Society and is recognized as an AMTA Fellow. His research interests include measurement uncertainty, time domain measurements for site validation and antenna calibration, and development of novel RF absorber materials. Several papers authored and co-authored by Mr. Chen have received best paper recognition at global conferences. Zhong Chen received his M.S.E.E. degree in Electromagnetics from the Ohio State University at Columbus. He may be reached at zhong.chen@ets-lindgren.com.
Presenter: Nicholas Abbondante, Intertek, Boxborough, MA
Subject: Don’t Get Tilted
Abstract: This presentation will review the rationale and concepts behind the antenna tilting changes in the C63.4 draft standard. Currently, test labs that are making measurements using both US and international standards need to be aware of and capable of supporting multiple different methods of testing above 1 GHz. After over a decade of testing using antenna tilting in C63 measurement standards, lessons have been learned about the pros and cons related to the use of tilting, which will be discussed in this presentation.
Biography: Nicholas Abbondante has served as Intertek’s Chief EMC Engineer since 2013, responsible for technical support of Intertek’s global network of 24 EMC labs. In his 22+ years with the company, he has been involved in testing a wide range of radio and electronic equipment to EMC requirements for regulatory domains around the world, specializing in transmitters and medical devices. He is the Technical Manager of Intertek’s TCB program and is TCB Council Board Vice Chair, and serves as the CISPR/A Secretariat. An active participant in many ANSC C63 standards projects, he is chair of both C63.31 for ISM device measurement and C63.25.3 for 18-40 GHz test site validation, and was recently elected as the incoming chair of Subcommittee 4 for wireless and ISM equipment measurements. He is also a working group member of C63.10 and C63.26 for radio testing, C63.4 Emissions, C63.16 ESD, C63.33 EAS immunity and the recently completed C63.2 Receiver, C63.29 Lighting and C63.30 Wireless Power Transfer standards. Nick has a Bachelor’s degree in physics from the Worcester Polytechnic Institute (WPI) in Massachusetts, USA. He may be reached at nicholas.abbondante@intertek.com
Presenter: Bob Mitchell, TÜV Rheinland
Subject: Live Demonstrations of Boresight and Linear Scan Methods in 10m Chamber
Abstract: As technology has evolved over the past decades, the equipment and methods that are used to test this technology is continuously evaluated to ensure that the best methods are being used. This demonstration will compare the Linear Scanning and Boresight Scanning methods when used at a 3m test distance with a 1m height reference. Identical antennas, identical measurement receivers, identical model of test cables, and identical masts will be utilized during this demonstration. The TÜV Rheinland Chamber was designed to run dual axis measurements as part of the 2025 automation program TÜV is implementing. Thus, the use of the TÜV Rheinland chamber has the exact capability to provide the comparison that is needed for this demonstration.
One test sample will be set up on the 0.8m high foam table, using two identical horn antennas taking measurements from 1 to 18 GHz at the same time and scanning from 1-4m in height. Given the specific parameters of the test, this demonstration is designed to show the similarities and differences of Linear and Boresight scanning methods. The goal is to provide additional insights on how best test methods can be developed as technology changes.
Biography: Bob Mitchell is the Director of Laboratory Technology and Innovation at TÜV Rheinland, based in Boxborough, MA. Bob also holds the role of EMC technical manager for TÜV Rheinland of North America. Along with the roles and tasks Bob does for TÜV Rheinland, Bob is one of the USNC member experts for the ISO, CISPR D, SAE, ANSC C63®, and 5GAA committees. Bob is also an active member of the Advisory Committee for Electromagnetic Compatibility for the IEC representing TC125, TC47 and the US National Committee. Over the course of his career, Bob has presented many workshops at the IEEE EMC+SIPI Symposiums, authored technical papers, and has supported technical data for development of many new EMC standards across the organizations. In the role of Director of Laboratory Technology and Innovation for TÜV Rheinland North America, Bob has the responsibility for developing and expanding test capabilities, opportunities, and test facilities in the various markets for TÜV Rheinland. He may be reached at rmitchell@us.tuv.com.
September 25th, 2024
EMI/EMC Summit 2024 Hosted by NTS/Element Labs and IEEE EMC Society Boston Chapter
NTS/Element and the IEEE EMC Society Boston Chapter hosted an EMI/EMC Summit at the NTS/Element Boxborough MA facility. Featured four expert speakers presenting the latest developments in EMI/EMC testing.
IEEE EMC & Element/NTS Presentation Topics:
Presenter: Sean Lynch, EMC Applications Engineer, Rhode & Schwarz
Subject: BCI System Demonstration
Abstract: The BCI system presentation will show how to calculate and measure a BCI system for ISO 11451, MIL-STD-461G, or IEC 61000-4-6. We will work backward given a test level, known transfer impedance from industry probes and equipment, and then follow good practices to size generators and amplifiers accordingly. After going through the calculations, the presenter will give a quick demonstration using industry software and show the class how close the measurements are versus actual using various supplied equipment.
Presenter: Scott Carlson, EMI Principal Engineer, Element
Subject:Practical Comparisons of Individual EMC Requirements and Test Procedures
Abstract: This discussion will provide a detailed comparisons of individual requirements and test methods in MIL-STD-461 with available commercial (non-military) standards that are the most similar. The differences in limits and test methodology will be identified and their potential significance will be discussed. Guidance is provided on judging the acceptability of a particular commercial standard for specific applications and if the testing conducted commercially can give an indication of compatibility to Mil Std 461.
Presenters: Patrick Mytinger & Edson Montrond, Engineers, Element.
Subject: Lightning Indirect Effects and Fuel System Test Methods.
Abstract: This discussion will provide detailed insights into lightning indirect effects and lightning fuel system test methods in the SAE ARP5416 commercial aircraft standard. Lightning indirect effects test methods to be discussed include full aircraft tests to measure cable bundle lightning-induced transients and bench tests to evaluate equipment and systems. Lightning fuel system test methods to be discussed include aircraft wing tests to map fuel system lightning currents and flammable fuel vapor tests to evaluate fuel tank coupon specimens, fuel system components, and complete fuel tanks.
Presenter: Garth D’Abreu, Director, Auto Solutions, ETS Lindgren.
Subject: EMC Chambers for MIL-STD and DO-160 Testing: The Good, the Bad and the Ugly…
Abstract: EMC testing has been underway for several decades. During this time, chamber design has not changed significantly despite improvements in the general understanding of RF interference sources and targets. This presentation will highlight some of the shortcomings of current chamber design – whether absorber-lined or reverberation chambers. Options will be reviewed for enhancements to the test and measurement environment that could improve measurement accuracy and repeatability. As a test lab, the ability to cost effectively and accurately perform a measurement in accordance with industry standards and an organization’s specific requirements is of paramount importance. Attendees will gain an understanding of how potential limitations introduced by the test setup may be addressed.
Thank you to Element for hosting this event, and thank you to all who attended our in-person event!
June19, 2024
Subject: Low Frequency Signal Integrity with Hardware Demonstrations.
Presenter: Lee Hill
Abstract: Since most electrical engineers and PCB designers did not learn about low frequency signal integrity and grounding in school, it can be challenging for them to achieve good low frequency signal integrity that is vital to the performance of closed-loop systems. Precision measurements and A/D conversion of temperature, flow, pressure, current, and voltage in modern energy conversion and motion control systems are simply not possible without excellent low frequency signal integrity. During this presentation, using a signal generator, current and magnetic field probes, and an oscilloscope, Lee will model, demonstrate, and measure the signal integrity, emissions, and immunity problems that can arise in low frequency circuits.
Biography: Lee Hill is Founding Partner of SILENT Solutions LLC, an electromagnetic compatibility (EMC) consulting firm he started in Silicon Valley in 1992. He is also Managing Director of Silent Solutions GmbH (Munich).
Lee received his MSEE with highest honors from the Missouri University of Science & Technology EMC Laboratory, where he studied under Dr.’s Thomas Van Doren, Todd Hubing, and James Drewniak.
Lee teaches a graduate course in EMC as a member of adjunct faculty at Worcester Polytechnic Institute (WPI), and is also an EMC course instructor for University of Oxford (England), and for the IEEE EMC Society’s annual Global University and Fundamentals Program. Lee is the named inventor of three US patents for EMI control in electronic systems, and provides expert witness services for patent litigation.
May 22, 2024
Subject: RF radiated emissions from Electric Vehicles – Regulatory challenges.
Presenter: Keith Frazier
Abstract: Unlike internal combustion engines, electric powertrain in automotive applications pose much greater challenges in meeting regulatory requirements with respect to far field radiated RF emissions. This talk will review the basic physical mechanisms of the EV powertrain that contribute toward RF emissions from the vehicle. Various mitigation techniques are summarized along with the engineering tradeoffs they create. Current and future regulatory requirements are also reviewed.
Biography: Keith Frazier, Senior Technical Leader of Electromagnetic Compatibility, Ford Motor Company, is responsible for oversite of all EMC design of Ford automotive products worldwide. His interests include system/subsystem design and analysis for EMC. Between receiving his BSEE from Purdue University in 1976 and joining Ford in 1990, Keith served as an EMC and TEMPEST design engineer for various automotive and aerospace firms including GM, Lockheed and Magnavox Government Electronics.
He is a Life Senior member of IEEE and has authored and presented over 12 technical papers and presentations at regional and international symposia. Keith has authored and co-authored multiple SAE and ISO immunity standards as an active member of the USTAG to CISPR D and ISO international standards committees.
In 2008, Keith served as Technical Papers Co-chair for the 2008 IEEE EMC Symposium held in Detroit Michigan. In the fall of 2023, he was elected as member at large of the EMC Society’s Board of Governors.
November 1st, 2023
Subject: EMI Testing on Space Systems
Presenter: Jens Medler
Abstract: The use of FFT-based measuring receivers is motivated by reducing the scan time by several orders of magnitude without degradation of accuracy and to get more insight due to the possibility of applying longer measurement times. Comparison measurements on a nanosatellite were performed using conventional EMI receiver and FFT-based time-domain scanning technique.
Biography: Jens Medler joined Rohde & Schwarz, Munich, Germany, a company specializing in test equipment and radio equipment in 1996. He is responsible for the standardization and application support of EMI test receivers and accessories for both hardware and software and is active member of various CISPR Subcommittees since 1999. He also holds a senior membership in the IEEE EMC Society and is acting vice chair of the societies Standards Development and Education Committee.
This includes CIS/A on EMC measurement instrumentation and methods, CIS/D on equipment on vehicles and internal combustion engine powered devices and CIS/I on information technology equipment, multimedia equipment and receivers. Since October 2017 he is acting as convenor of CIS/A WG2; the CISPR Working Group on EMC measurement methods, statistical techniques and uncertainty. He is recipient of the IEC 1906 Award.
September 27th, 2023
EMI/EMC Summit 2023 Hosted by NTS Labs and IEEE EMC Society Boston Chapter
NTS and the IEEE EMC Society Boston Chapter hosted an EMI/EMC Summit at the NTS Boxborough facility. World-renowned EMI/EMC experts: Duy Ho, Regulatory Lab Manager with Element/NTS Labs, Scott Carlson, EMI Principal Engineer with Element/NTS Labs, and Colin Brench, Courtesy of IEEE, provided technical presentations and vendors were available to meet with attendees.
Thank you to all who attended our in-person event! Please see below for presentation materials.
IEEE EMC & Element/NTS Presentations
Subject: FCC Regulatory Compliance Process & Challenges for Wireless Devices
Presenter: Mr. Duy Ho
Subject: Methods of Measuring Shielding Effectiveness
Presenter: Mr. Scott Carlson
Subject: The Art and Science of EMC Design
Presenter: Mr. Colin Brench
May 3rd, 2023 6 PM EDT
Subject: Unintentional Antennas
Presenter: Ms. Karen Burnham
Abstract: One of the biggest causes of EMC test failures is radiating structures in a unit, whether from the PCB or cabling, that are acting in ways designers never intended. This talk covers basics of antenna theory and how to identify potential radiating “antennas” in your product.
Biography: Karen Burnham is a Principal Scientist at Electro Magnetic Applications in Denver, CO. She is an iNARTE-certified EMC engineer with experience in both the aerospace/defense and automotive industries. At NASA JSC, she worked on the Orion spacecraft and pyrotechnic systems. She was able to work on the Dream Chaser spacecraft and the F-35 fighter jet. She spent several years working at Ford Motor Company on traditional vehicles like the Ford Edge and Lincoln Continental as well as on their line of electric hybrid vehicles such as the Ford Explorer and Lincoln Aviator. Ms. Burnham is a member of the IEEE EMC Society Board of Directors where she serves as Assistant Vice President of Standards. She holds a BS degree in Physics from Northern Arizona University and an MS degree in Electrical Engineering from the University of Houston.
She can be reached at: karen.burnham@ieee.org
April 5th 2023
Subject: Smart Grid EMC Standards
Presenter: Mr. Jerry Ramie
Abstract: This presentation describes the IEEE standards work undertaken in the last six years on refining the immunity testing requirements for devices with communications functions. The new P1613 draft harmonizes closely with the current IEC requirements for electric utility equipment with some differences. Its harmonized Scope includes most utility-owned smart grid equipment controls with a COM port or COM functionality.
Biography: Jerry Ramie is a 42-year veteran of the EMC test and measurement business. He is Secretary of the ANSC-C63® Committee on EMC, a 2011 Distinguished Lecturer for the EMC Society on Smart Grid, our liaison to the Power & Energy Society, an iNARTE-certified EMC technician, and a Life Senior Member of the IEEE. He can be reached at: jramie@arctechnical.com.
September 28th, 2022
EMI/EMC Summit 2022 Hosted by NTS and IEEE EMC Society Boston Chapter
NTS and the IEEE EMC Society Boston Chapter hosted an EMI/EMC Summit at the NTS Boxborough facility. World renowned EMI/EMC experts Jeff Viel, Chief Engineer at NTS, Zhong Chen, Director of RF Engineering at ETS-Lindgren, and Yibo Wang, RF Engineer at ETS-Lindgren, provided technical presentations and vendors were available to meet with attendees.
Thank you to all who attended our first in-person event in ~ 3 years! Please see below for presentation materials.
NTS Presentations
Subject: RTCA / DO160G Overview
Presenter: Jeff Viel, Chief Engineer, NTS
Abstract: This one-hour session will cover a general overview of each test electrical and EMI related method (sections 15 through 23 and section 25). Comparisons will be made to aircraft platform requirements defined in MIL-STD-461G test setup. This session will also highlight some of the most common product compliance issues encountered during DO160G testing, and lend advice on how they are remedied.
Subject: MIL-STD-461G Overview
Presenter: Jeff Viel, Chief Engineer, NTS
Abstract: This one-hour session will cover basic principles for EMI/EMC testing, and the purpose of the MIL-STD-461 standard. A general overview of each test method and importance of test setup, equipment configuration and operation are discussed. This session will also highlight some of the most common product compliance issues encountered during MIL-STD-461G testing, and lend advice on how they are remedied.
Subject: INTERNATIONAL EMI/EMC STANDARDS COMPARISON
Presenter: Jeff Viel, Chief Engineer, NTS
Abstract: This one-hour session will compare and contrast the product compliance requirements across several industries in an effort to highlight changes in platform electromagnetic environments, and how these changes can lead to severe compliance risks for multifunctional products deployed across a variety of commercial and defense platforms.
Jeff Viel is one of the world’s top authorities in E3 system risk analysis, design hardening, and EMC product testing. Jeff has over 20 years of experience with product testing and design focusing on the Aerospace, Defense, Telecom, and Power Industries. He holds both a Bachelor of Science and Master of Science in Electrical Engineering from Northeastern University.
ETS-Lindgren Presentations
Subject: Basic Concepts of Antenna Characterization and Applications in EMC Measurement
Presenter: Zhong Chen, Director of RF Engineering, ETS-Lindgren
Abstract: There are some practical considerations for antennas used for EMC measurements; for example, EMC antennas are typically extremely broadband and low gain. At below 1 GHz, these antennas are used over a perfect electrical conductor (PEC) ground plane. This presentation provides an introduction and discussion of the antenna fundamental parameters from an application point of view, especially on how these antenna parameters are characterized and applied in EMC applications. We will review the definition of Antenna Factor (AF), its relationship to antenna gains, and mismatch losses. We will also look at other parameters often used in EMC applications, such as antenna balance, phase center, and site attenuation. A brief introduction to EMC antenna calibration methods will be provided, including a reference to dipole-like antennas, which are ubiquitous for EMC measurements below 1 GHz. Finally, we will discuss how these antenna parameters, such as the free-space antenna factors, are impacted by the presence of the conducting ground plane.
Subject: Cylindrical Mode Filtered SVSWR: A New ANSC C63 Method Proposed for EMC Site Validation from 18 to 40 GHz
Presenter: Yibo Wang, RF Engineer, ETS-Lindgren
Abstract: This presentation will introduce the new method of EMC site validation for high frequency range 18-40GHz, based on use of Cylindrical Mode Filtered SVSWR (CMF SVSWR). This CMF SVSWR provides a more comprehensive evaluation of EMC chamber quiet zone, and can be readily measured without any special positioning fixtures. This new measurement technique is under consideration for the new draft standard ANSI C63.25.3 in development by the ANSC C63 committee for EMC test sites from 18 GHz to 40 GHz.
For more details, the following papers are also published by IEEE Transaction on Instrumentation, EMC Europe 2022 and AMTA 2020 and 2021 conferences. They can be downloaded from IEEE Xplore:
Z. Chen and S. F. Gregson, "EMC Chamber Quiet Zone Qualification for Applications Above 1 GHz Using Frequency Domain Mode Filtering," in IEEE Transactions on Instrumentation and Measurement, vol. 70, pp. 1-9, 2021, Art no. 6504909, doi: 10.1109/TIM.2021.3119143.
Z. Chen and S. Gregson, "Examination of EMC Chamber Qualification Methodology for Applications above 1 GHz using Frequency Domain Mode Filtering," 2020 Antenna Measurement Techniques Association Symposium (AMTA), 2020, pp. 1-6.
Z. Chen and S. Gregson, "Intercomparisons of Site VSWR Measurement Methods using Mode Filtering, Time Domain and Spatial Sampling Techniques," 2021 Antenna Measurement Techniques Association Symposium (AMTA), 2021, pp. 1-6, doi: 10.23919/AMTA52830.2021.9620661.
Z. Chen, P. Miller, “Extending Site VSWR to Millimeter Wave using Cylindrical Mode”, International Symposium on Electromagnetic Compatibility, September 5-8, 2022, Gothenburg, Sweden.
Biography: Zhong Chen is the Director of RF Engineering at ETS-Lindgren, located in Cedar Park, Texas. He has over 25 years of experience in RF testing, anechoic chamber design, as well as antenna and EMC field probe design and measurements. He is currently a member of the Antenna Measurement Techniques Association (AMTA) Board of Directors. Mr. Chen is the Chair of Subcommittee 1 of ANSC C63 which is responsible for EMC antenna calibration and test site validation standards. He is also chair of the IEEE Standard 1309 committee responsible for developing calibration standards for field probes, and IEEE Standard 1128 for absorber measurements. He has served as a Distinguished Lecturer for the IEEE EMC Society. His research interests include measurement uncertainty, time domain measurements, and development of novel RF absorber materials. Mr. Chen received his M.S.E.E. degree in Electromagnetics from the Ohio State University at Columbus.
Biography: Yibo Wang is a RF Engineer at ETS-Lindgren. He has extensive experience in chamber design and modeling, absorber modeling and RF testing. His research focuses on dielectric measurement techniques, antenna measurements and near field to far field techniques. He received his PhD degree in Electromagnetics from University of Houston, his Masters degree from the Ohio State University and Bachelors degree from Wuhan University.
June 22nd, 2022
Subject: EMC and Electromagnetics for the Working Engineer
Presenter: Dr. Bruce Archambeault
Abstract: Electromagnetics theory is surrounded by mystery and magic. Mostly because the mathematics needed to solve Maxwell’s equations are messy enough that most of us avoid them at all costs! EMI/EMC is even worse, and often considered voodoo magic! This presentation is intended to remove the mystery behind EMI/EMC and electromagnetics by explaining things in everyday terms, and without the mathematics. Some of the basic symbols used in mathematics, such as integration, derivatives, and weird vector symbols are explained. Then using these simple explanations, Faraday and Maxwell’s contribution to electromagnetics is explained. These concepts are not just university-only-interest, they have real world application in the design of electronic equipment both for EMI/EMC control as well as high speed signal quality issues. Faraday’s law is an introduction to inductance, and this presentation will examine inductance and it’s impact on printed circuit board (PCB) design, the concept of “ground”, and return current flow in typical printed circuit board stackups. Various typical mistakes during PCB design that greatly impact the EMI/EMC performance will be demonstrated during this discussion. Simple design approaches that do not increase the cost of the PCB are explained.
Dr. Bruce Archambeault is an IEEE Fellow, an IBM Distinguished Engineer Emeritus and an Adjunct Professor at Missouri University of Science and Technology. He received his Ph. D. from the University of New Hampshire in 1997. His doctoral research was in the area of computational electromagnetics applied to real-world EMC problems. He has taught numerous seminars on EMC and Signal Integrity across the USA and the world, including the past 15 years at Oxford University.
Dr. Archambeault has authored or co-authored a number of papers in computational electromagnetics, mostly applied to real-world EMC applications. He currently serves as the Immediate Past President of the EMC Society. He is the author of the book “PCB Design for Real-World EMI Control” and the lead author of the book titled “EMI/EMC Computational Modeling Handbook”.
April 20th, 2022
Subject: Common Misconceptions about Inductance & Current Return Path
Presenter: Dr. Cheung-Wei Lam
Abstract: In today’s high-speed system designs, a good understanding of inductance and current return path is important for signal integrity and EMI control. Unfortunately, several key concepts about the two have often been misunderstood or overlooked. This presentation will discuss the main concepts and some common misconceptions about inductance and current return path. Examples will be given at the chip and PCB levels.
Dr. Cheung-Wei Lam is a Distinguished Engineer and Chief EM Technologist at Apple. Prior to Apple, he was a co-founder at Transcendent Design Technology and a principal engineer at Quad Design Technology.
Dr. Lam received B.S. from the Chinese University of Hong Kong, and S.M./Ph.D. from MIT.
He currently serves as an IEEE EMC Society Respected Speaker and was a past IEEE EMC Society Distinguished Lecturer.
November 3rd, 2021
Subject: Electromagnetic Shielding: Concepts and Applications
Presenter: Dr. Sergiu Radu
Abstract: Every electronic equipment uses some type of shielding, and from a theoretical point of view, electromagnetic shielding is among the most difficult areas of EMC. The presentation is introducing basic shielding concepts, insisting on their practical limitations, and presents the typical engineering problems associated with shielding. Among the aspects discussed are the materials used for shielding, chassis resonances, shielding integrity problems (seams, joints, apertures, perf patterns, etc.), aperture coupling and shield's grounding.
Sergiu Radu (M’93, SM’02) received the M.S. and Ph.D. degrees in electrical engineering (Electronics) from the Technical University of Iasi, Iasi, Romania in 1980 and 1995, respectively. He was an Associate Professor at the Technical University of Iasi until 1996, involved in Electromagnetic Compatibility teaching and research. From 1996 to 1998, he was a Visiting Scholar at the University of Missouri at Rolla, currently Missouri University of Science and Technology, as part of the Electromagnetic Compatibility Laboratory. In 1998, he joined the EMC Engineering group at Sun Microsystems, which became a part of Oracle Corp. in 2010. He is currently Director of Hardware Development at Oracle leading the EMC Design group in Santa Clara, CA., involved in chassis level, PCB level and chip level EMC design for all Oracle hardware products. His role includes also the development and implementation of platform level EMC Design architecture, design methodologies, and better EMC prediction techniques. He holds seven US patents for EMI reduction techniques in electronic systems and has published more than 50 technical papers, presentations and reports on electromagnetic compatibility related subjects. He is NARTE Certified EMC Engineer since February 1998, a former IEEE EMC Distinguished Lecturer (2009-2010), and a reviewer for IEEE Transactions on EMC. ORCID (Open Researcher and Contributor ID): https://orcid.org/0000-0002-1733-1151
May 19, 2021
Subject: Radio Frequency Interference and the Radio Amateur (RFI Seminar)
Presenter: Mr. Ed Hare, Vice President of Standards for the Board of the EMC Society
ARRL Laboratory Manager (American Radio Relay League)
Abstract: EMI is a problem that affects hams and their neighbors alike. Ed Hare, W1RFI, ARRL Laboratory Manager and one of the editors of the ARRL RFI Book, has put together this 30-minute slide presentation to give an overview of politics, personalities and technical issues involved in EMI control. His presentation outlines the standard causes and cures for interference. The question-and-answer session that follows the formal slide presentation turns this into a real RFI workshop.
Presentation materials coming soon
Ed Hare, W1RFI, is employed by ARRL, the National Association for Amateur Radio. After an industry career in product testing, he came to work at ARRL HQ in 1986. He started as ARRL’s "Product Review" test engineer, moved on to becoming ARRL’s "RFI guru" (notice his call!) and he now holds the position of Laboratory Manager. Over the years he has written quite a number of RFI articles, ranging from articles for QST and the "ARRL Handbook" to articles about the practical aspects of RFI that have appeared in professional trade journals. He is also one of the authors of the ARRL "RFI Book" and the editor of the ARRL's book on RF exposure, "RF Exposure and You."
He is very active holding a seat for Amateur Radio on various industry committees, serving as a voting membership on the IEEE EMC Society Standards Development and Education Committee, the ANSI accredited C63® EMC Committee as Chair of Subcommittee 5 on Immunity, and is the IEEE EMC Society Vice President of Standards, representing ARRL and the interests of Amateur Radio as industry standards are developed. He is a member of the IEEE Standards Association, the IEEE EMC Society and the IEEE Power Engineering Society.
Ed serves the RF Safety Committee as a voting member and as the ARRL HQ staff liaison.
His personal operating interest is QRP CW, where Ed’s motto is, “Five Watts is a Lot of Power!” He is presently doing work on HF using 10 milliwatts, reporting 30 states worked, all in the ARRL CW Sweepstakes.
Email: W1RFI@arrl.org Web: http://www.arrl.org
April 21, 2021
Subject: Lightning Interaction with Transmission and Distribution Power Systems
Presenter: Prof. Dr. Alexandre Piantini, University of São Paulo, Brazil
IEEE EMC Society Distinguished Lecturer
Abstract: In recent years, the growing use of sensitive electronic devices and the increasing demand of utility customers for power supply stability have emphasized the importance of improving electric systems' reliability and power quality levels. Although various phenomena and situations can cause disturbances on power transmission and distribution networks, lightning is usually responsible for a significant amount of unscheduled supply interruptions and permanent damages to equipment such as distribution transformers, as well as damages to or malfunction of sensitive electronic equipment. It is therefore essential to evaluate the lightning electromagnetic environment to mitigate its effects and improve the power system quality. In this talk, after an introduction that includes an overview of the main lightning processes, the major mechanisms by which lightning overvoltages can be produced in power transmission and distribution (medium and low-voltage) systems are explained. Then, the overvoltages' general characteristics are evaluated and their dependence upon the network configuration and some of the most important ground and stroke parameters are discussed, with examples of measured and calculated voltage waveshapes.
Prof. Piantini (SM’04) received the M.Sc. and Ph.D. degrees from the Polytechnic School of the University of São Paulo, São Paulo, Brazil, in 1991 and 1997, respectively. He joined the University of São Paulo in 1986 and served, from 1998–2011, as Director of Technological Development of the Institute of Energy and Environment, where he is Associate Professor and the Head of the Lightning and High Voltage Research Centre. He was the Convener of the CIGRE WG C4.408 “Lightning Protection of Low-Voltage Networks” and member of various IEEE and CIGRE working groups. He is Associate Editor of the IEEE Transactions on Electromagnetic Compatibility, Electrical Engineering, High Voltage, and member of the Editorial Advisory Panel of the Electric Power Systems Research. He has participated in 26 research projects related mainly to lightning and EMC. He coordinated 21 of these projects, of which 15 funded mainly by power companies and national agencies for research support. Prof. Piantini is the Chairman of the Int. Symposium on Lightning Protection (SIPDA) and member of scientific committees of various conferences such as the Int. Conf. Lightning Protection (ICLP). He is a Guest Professor of the Chongqing University, China, and a member of the IEEE Award Committee of the Sun & Grzybowski Award. In 2018 he was the recipient of the ICLP R. H. Golde Award. He is the Editor of two books (IET), author or co-author of eight book chapters, and over 150 scientific papers published in prestigious reviewed journals or presented at international conferences with review board. E-mail: piantini@iee.usp.br
December 15, 2020
Subject: Emerging Technologies: The Impact of Modern Robotics, Data Analysis, and CEM Simulation on Antenna and EMC Measurements in 2021 and Beyond!
Abstracts and Speakers/Bios: PDF
For those who were not able to join in the live webinar session, you can find the recording of the event here.
October 14, 2020
Subject: EMI Suppression Ferrites, Four Classes
Presenters: Michael Arasim & Bruce Sparrow, Fair-Rite Products Corp.
Abstract: The lecture will include a description of ferrites, how they are made, and how they work. The four classes of ferrites will be discussed along with their uses and applications.
Michael Arasim is the Power and Inductive Products Manager at Fair-Rite Products Corp. Michael has been with Fair-Rite for over 7 years and has previously served as Electrical Lab Team Leader. In his previous role, Michael was responsible for overseeing all electrical lab activities. This included setting test procedures/specifications, characterizing materials, making process improvements, and supporting production efforts across Fair-Rite’s different facilities. In his current role Michael is responsible for overseeing development projects, marketing efforts, and providing application support for Fair-Rite’s power and inductive rated parts and materials.
Bruce Sparrow is in a new role as the Suppression Products Manager at Fair-Rite Corporation. Prior to this, Bruce was the Area Sales Manager for Fair-Rite Products and had responsibility for sales management in a twenty-state territory. In his new role he is charged with furthering Fair-Rite’s position as the as the leader in EMI suppression products and helping develop new products for the industry. Bruce has a personal interest in EM compliance – as a lifelong ham radio operator, keeping the RF noise floor as low as possible through suppression and shielding is of paramount interest.
September 30, 2020
Subject: How PDN Filters Impact the EMC Performance
Presenter: Istvan Novak, PhD, Samtec
Abstract: This webinar will explore power distribution filters, primarily power distribution networks with a series inductor or ferrite bead, but also parallel-only bypass schemes. We will show how the filter performance may impact EMC performance. We will devise a straightforward process to find the component values, will show the effect of DC bias voltage and DC load current and will show the proper ways to characterize power filters.
Istvan is a Principle Signal and Power Integrity Engineer at Samtec, working on advanced signal and power integrity designs. Prior to 2018 he was a Distinguished Engineer at SUN Microsystems, later Oracle. He worked on new advanced power distribution design and validation methodologies. He was responsible for the power distribution and high-speed signal integrity designs of SUN's successful workgroup server families. He introduced the industry's first 25 um power-ground laminates for large rigid computer boards and worked with component vendors to create a series of low-inductance and controlled-ESR bypass capacitors. He also served as SUN's representative on the Copper Cable and Connector Workgroup of InfiniBand, and was engaged in the methodologies, designs and characterization of power-distribution networks from silicon to DC-DC converters. He is a Life Fellow of the IEEE with twenty-five patents to his name, author of two books on power integrity, teaches signal and power integrity courses, and maintains an SI/PI website.